Key information
An unreleased AMD Ryzen 9 5900X3D engineering sample has been spotted on the Chinese forum Chiphell. The 12-core, 24-thread Zen 3 processor features the code 100-000000652 and includes 128 MB of L3 cache. This cache is divided unevenly, with 96 MB located on one CCD and 32 MB on the other, indicating that only a single six-core chiplet features the 64 MB 3D V-Cache stack.
This configuration differs from prototypes AMD previously demonstrated to Gamers Nexus in 2023, which featured cache stacked on both CCDs for a total of 192 MB. The single-stack architecture allows the newly surfaced sample to achieve higher clock speeds, with CPU-Z screenshots indicating speeds around 4.7 GHz at a 105 W TDP, compared to a 4.4 GHz boost limit for the dual-stack variant.
Booting the engineering sample required an older BIOS featuring SMU firmware 56.70.0, as it reportedly does not function on current BIOS versions. The owner has requested ASRock to provide support in a future BIOS update. AMD has not officially confirmed the sample, and forum posts remain unverified claims.
