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Frore Systems has announced the LiquidJet Diamond, a new liquid cooling coldplate designed for AI factories. By integrating diamond wafers into the company's existing 3D ultra short-loop multi-stage design, the product aims to address the rising power density and thermal challenges faced by modern AI GPUs.
The coldplate features a unique architecture that can be customized to specific GPU power maps. While the standard LiquidJet provides a 12°C reduction in die temperature, the Diamond variant adds an integrated spreader to target extreme hotspots, delivering an additional 10°C reduction and enabling cooling for densities up to 770 W/cm².
According to CEO Seshu Madhavapeddy, this technology improves AI Tokens/Watt efficiency by 35% compared to traditional skived coldplates. This efficiency gain allows operators to generate more tokens within existing power budgets, potentially increasing profitability and reducing the need for additional infrastructure construction.
Frore Systems claims its manufacturing process supports the scale and reliability required by hyperscalers, unlike some additive manufacturing methods. The technology is designed to accommodate varying GPU sizes, ranging from the 1,488 mm² NVIDIA Blackwell Ultra to the 46,225 mm² Cerebras Wafer-Scale Engine.
Live demonstrations of the LiquidJet Diamond, including cooling for the 2300 W NVIDIA Rubin, are scheduled for the 2026 OCP Global Summit held in San Jose, California, from October 12-16, 2026.
