Key information
Server cooler manufacturer Dynatron has published website references indicating that AMD's upcoming EPYC Verano processors will utilize a new socket named SB1. Dynatron published a product page for an active cooler labeled as SB1-4U-ACTIVE (TBD) with a pending final name.
The processors will employ 24 channels of LPDDR5X memory via replaceable SOCAMM2 modules. Verano serves as the codename for the EPYC 9006 LP, which is a Zen 6 part scaling up to 72 cores with boost frequencies reaching up to 5 GHz.
The maximum power specification is marked as TBD, and the physical dimensions of 128.05 x 106.6 x 130.7 mm match Dynatron's existing J26 cooler for SP7, suggesting the listed specifications might be placeholders. Additionally, the letter B in SB1 could indicate a soldered BGA package, though this remains an unofficial guess.
AMD designed Verano for AI racks to serve as a host processor for GPU clusters, scheduling the product launch for the second half of 2027. Regular Venice chips utilize different sockets, specifically SP7 supporting up to 256 cores and SP8 supporting up to 128 cores, while AMD has not yet officially disclosed the socket name for Verano.
