Key information
AMD is developing the EPYC 9006-series, codenamed Verano, specifically for AI server environments. According to a Dynatron listing discovered by InstLatX64, these processors will utilize a unique SB1 socket. This hardware departure from the SP7 and SP8 sockets used by other Zen 6-based EPYC chips necessitates distinct cooling solutions.
The Verano architecture is highly specialized, featuring up to 72 Zen 6 cores with clock speeds reaching 5 GHz. A notable technical feature is its 24-channel LPDDR5X memory subsystem, which utilizes replaceable SOCAMM2 modules. Unlike general-purpose EPYC processors, Verano is designed to act as a host for AI accelerators, prioritizing orchestration over raw core counts.
Dynatron has listed an SB1-4U-Active cooler, which features a vapor chamber, heat pipes, and a fan capable of 6,000 RPM. While the cooler's dimensions resemble those of the J26 model for SP7 sockets, it remains unclear if these specifications are final or placeholders. The robust cooling design suggests significant power requirements, though official TDP figures remain unconfirmed.
By adopting a dedicated socket, AMD may be aiming to simplify system qualification and ensure consistent performance ratios between CPU cores and memory bandwidth, similar to Nvidia's approach with Grace processors. AMD has not yet disclosed full specifications for the SB1 socket, and the Verano lineup is currently scheduled for a launch in the second half of 2027.
