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AMD has introduced Helion, a new standardized 21-inch rack-scale reference design for data centers. Designed to complement the existing Helios rack, Helion is built upon the Open Compute Project’s ORv4 specification and supports 44 OpenU trays. The architecture is compliant with the Data Center Modular Hardware System standard to ensure infrastructure interoperability.
The platform offers significant compute density, capable of housing up to 32,768 Zen 6 cores in a CPU-only configuration using 128 EPYC 9996 Venice processors. Alternatively, the flexible design supports a hybrid setup featuring up to 16 MI350P GPUs alongside 102 Tbps of networking capacity, intended for enterprises requiring integrated data management and AI capabilities.
AMD positions this hardware as a solution for agentic AI workloads, where CPU-heavy sandboxes handle tasks like software development while offloading intensive inference to separate systems. The reference design accommodates both air-cooled and direct liquid-cooled deployments, though AMD will not sell the racks directly, instead providing the design to OEMs and ODMs.
While specific deployment partners remain unannounced, AMD expects availability to begin in the first half of 2027. The company plans to disclose further details regarding supporting partners during the OCP Global Summit keynote.
