ព័ត៌មានសំខាន់
Intel has officially begun installing production equipment at its Fab 62 facility located at the Ocotillo campus in Arizona. The company expects this site to become operational before the end of 2028. This development marks a significant step forward in expanding Intel's domestic manufacturing footprint, following the completion of the building's shell.
While the specific process nodes for Fab 62 remain unassigned, the facility is capable of supporting 18A, 18A-P, and 14A technologies. Intel has also confirmed the integration of High-NA EUV lithography into its high-volume manufacturing processes. The company has already utilized these scanners at its D1X development fab in Oregon to produce select tiles for Panther Lake processors.
Regarding the Ohio One manufacturing complex, Intel reported that construction crews recently installed the first major structural truss at the site's initial semiconductor fab. Despite this progress, the company has not provided an updated construction schedule, a timeline for when operations will commence, or details regarding the facility's intended process technology and manufacturing capacity.
Intel continues to emphasize its domestic supply chain, noting that it works with over 4,500 suppliers across 49 states with annual U.S. expenditures exceeding $29 billion. Beyond wafer fabrication, the company is investing in advanced packaging, R&D, and a new photomask manufacturing facility in Santa Clara, California, to maintain its competitive position in the United States.
