मुख्य जानकारी
GlobalFoundries has unveiled FDX Fusion, a new semiconductor technology that marks the company's return to the leading-edge node race. This development follows the firm's 2018 decision to halt 7 nm node development due to rising costs and complexity.
The FDX Fusion platform utilizes fully-depleted silicon-on-insulator technology to create an insulating layer beneath the channel. This architecture supports ultra-low-power in-memory computing, embedded non-volatile memory, and dense logic designs. The company reports that this node achieves 7 nm-class characteristics and doubles the transistor density of its 22FDX predecessor.
GlobalFoundries intends to target specialized applications including physical AI layers, automotive systems, and ASICs. The technology is designed to address modern requirements for sensing and heavy computational tasks.
Mass production is scheduled for 2028 at the company's Dresden, Germany facility, which is expected to bolster European chip sovereignty. Technology demonstrations are anticipated next year, with process design kits slated for release in mid-2027.
