मुख्य जानकारी
During the 2026 OCP Global Summit, AMD CEO Dr. Lisa Su introduced the next-generation EPYC "Verano" server CPU. Part of the EPYC 9006 "LP" family, these processors are engineered for agentic AI racks and utilize the TSMC 2 nm manufacturing process.
The Verano architecture supports LPDDR5X memory through SOCAMM2 modules, aligning with industry trends seen in NVIDIA's Vera CPUs. These chips operate on the new SP8 platform and facilitate high-speed connectivity to Instinct MI500 GPUs via xGMI at speeds reaching 112 Gbps.
Technical reports from System360Cheese on X suggest the hardware utilizes eight Zen 6 CCDs paired with two IO dies and four memory controllers. While initial projections cited 72 cores, the updated specifications confirm a capacity of up to 192 cores, potentially achieved through a dual 96-core configuration.
Verano is slated for integration into the Helion agentic AI rack, a system designed under Open Compute Project specifications. AMD has scheduled the official availability for these processors in 2027.
